Converter and conversion method for converting click position of display into light pen simulated signal for semiconductor manufacturing machine

ABSTRACT

Converter and conversion method for converting a click position of a flat panel display into a light pen simulated signal for a semiconductor manufacturing machine are provided. A converter includes a first connector, a second connector, and a controller coupled between the first connector and the second connector. The first connector is configured to obtain the click position from the flat panel display. The second connector is configured to provide the light pen simulated signal to the semiconductor manufacturing machine according to a synchronization signal from the semiconductor manufacturing machine. The controller is configured to generate the light pen simulated signal according to the click position and a mapping table of a first display resolution of the flat panel display and a second display resolution of the semiconductor manufacturing machine. The first display resolution is higher than the second display resolution.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.17/120,663, filed on Dec. 14, 2020, which is a Continuation of U.S.application Ser. No. 16/669,007, filed on Oct. 30, 2019, now U.S. Pat.No. 10,866,653, which is a Continuation of U.S. application Ser. No.15/495,075, filed on Apr. 24, 2017, now U.S. Pat. No. 10,466,810, whichclaims priority of U.S. Provisional Application No. 62/431,457, filed onDec. 8, 2016, the entirety of which are incorporated by referenceherein.

BACKGROUND

In the semiconductor industry, semiconductor manufacturing machines areindispensable and expensive equipment for manufacturing a plurality ofsemiconductor devices. In the manufacturing process of semiconductordevices, an operator needs to control various operations of thesemiconductor manufacturing machine or input data through a graphicaluser interface (GUI) of the semiconductor manufacturing machine.

Semiconductor manufacturing equipment suppliers may provide their ownuser interfaces. For example, light pens have been used for many yearswith cathode-ray-tube (CRT) monitors to input data to the semiconductormanufacturing machines. This type of user interface provides a means forusers to enter information into the semiconductor manufacturing machinewithout requiring the use of a mouse, a keyboard, or another data-entrydevice.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 shows a semiconductor manufacturing system, in accordance withsome embodiments of the disclosure.

FIG. 2 shows the converter of FIG. 1, in accordance with someembodiments of the disclosure.

FIG. 3 shows a schematic illustrating a mapping relationship between afirst display resolution 1280×960 of a display apparatus and a seconddisplay resolution 640×480 of a semiconductor manufacturing machine.

FIG. 4 shows a waveform illustrating a horizontal synchronization signalHsync and a vertical synchronization signal Vsync provided by asemiconductor manufacturing machine, in accordance with some embodimentsof the disclosure.

FIG. 5 shows a conversion method for converting a click position of adisplay into a light pen simulated signal for a semiconductormanufacturing machine, in accordance with some embodiments of thedisclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the subject matterprovided. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. In some embodiments, theformation of a first feature over or on a second feature in thedescription that follows may include embodiments in which the first andsecond features are formed in direct contact, and may also includeembodiments in which additional features may be formed between the firstand second features, such that the first and second features may not bein direct contact. In addition, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

Some variations of the embodiments are described. Throughout the variousviews and illustrative embodiments, like reference numbers are used todesignate like elements. It should be understood that additionaloperations can be provided before, during, and/or after a disclosedmethod, and some of the operations described can be replaced oreliminated for other embodiments of the method.

FIG. 1 shows a semiconductor manufacturing system 100, in accordancewith some embodiments of the disclosure. The semiconductor manufacturingsystem 100 includes a display apparatus 110, a converter 120, and asemiconductor manufacturing machine 130.

The display apparatus 110 includes a flat panel monitor for displaying agraphical user interface (GUI) of the semiconductor manufacturingmachine 130. In some embodiments, the flat panel monitor is aliquid-crystal display (LCD), a light-emitting diode (LED) display, anorganic light-emitting diode (OLED) display, a thin film transistor(TFT) display or a plasma display with a touch screen. Users can click aspecific option (or icon) of the GUI displayed on a display screen ofthe display apparatus 110, and then the display apparatus 110 canprovide click information to the converter 120.

In FIG. 1, the semiconductor manufacturing machine 130 is anold-generation machine capable of manufacturing 6-inch or 8-inch wafers.Typically, users can control various operations of an old-generationmachine through a cathode ray tube (CRT) monitor and a light pen. Insome embodiments, a light pen is an input device for the semiconductormanufacturing machine 130. The light pen includes a light sensor fordetecting light emitted from a CRT monitor coupled to the semiconductormanufacturing machine 130. The scan time of the electron beam inside theCRT monitor from a starting point of the electron beam on a displayscreen of the CRT monitor is measured until the light sensor of thelight pen detects the light caused by the electron beam. Thus, thehorizontal and vertical positions of the light pen on the display screenmay be calculated according to the scan time. According to the light penlocation on the display screen of the CRT monitor, the semiconductormanufacturing machine 130 can perform an operation corresponding to thelight pen location.

At present, flat panel monitors are more popular than CRT monitors dueto problems with CRT monitors such as a short-lifespan, a lack ofbrightness, abnormal RGB color, a high current draw, and so on.Furthermore, a CRT monitor and light pen are more expensive today than aflat panel monitor.

The converter 120 is coupled to the display apparatus 110 and thesemiconductor manufacturing machine 130 in a wired manner. In someembodiments, the converter 120 is coupled to the display apparatus 110through a first cable supporting the RS232 serial port standard and asecond cable supporting the video graphics array (VGA) standard (e.g. aD-subminiature (D-sub) cable). Furthermore, the converter 120 is coupledto the semiconductor manufacturing machine 130 through a third cablesupporting the VGA standard (e.g. a D-sub cable). The converter 120 iscapable of providing a light pen simulated signal to the semiconductormanufacturing machine 130 according to the click information from thedisplay apparatus 110, so as to control the operation of thesemiconductor manufacturing machine 130 without using a CRT monitor anda light pen.

In some embodiments, the display apparatus 110 and the converter 120 canbe implemented in an electronic device, such as a notebook PC.

FIG. 2 shows the converter 120 of FIG. 1, in accordance with someembodiments of the disclosure. The converter 120 includes a connector210, a controller 220, a connector 230, and a connector 240.

Referring to FIG. 1 and FIG. 2 together, the connectors 210 and 230 aredifferent types of connectors, and the connectors 230 and 240 are thesame type of connectors. The connector 210 is an RS232 connector, andthe converter 120 is coupled to the display apparatus 110 of FIG. 1through the connector 210 and an RS232 cable. The connector 230 is aD-sub connector, and the converter 120 is coupled to the semiconductormanufacturing machine 130 of FIG. 1 through the connector 230 and aD-sub cable. Moreover, the connector 240 is a D-sub connector, and theconverter 120 is coupled to the display apparatus 110 of FIG. 1 throughthe connector 240 and a D-sub cable. In some embodiments, the connector230 is a 25-pin D-sub connector, and the connector 240 is a 15-pin D-subconnector.

In some embodiments, the display apparatus 110 of FIG. 1 is a displaymodule formed by a display without a touch screen and a touch panel thatare independent of each other. The converter 120 is coupled to thedisplay without a touch screen via the connector 240. Furthermore, theconverter 120 is coupled to the touch panel via the connector 210.

The controller 220 includes an interface circuit 222, a processor 224,an interface circuit 226, and a memory 228. In some embodiments, thecontroller 220 is implemented in a field programmable gate array (FPGA)or an integrated circuit.

The interface circuit 222 is coupled between the connector 210 and theprocessor 224. When the connector 210 is coupled to the displayapparatus 110, the interface circuit 222 is capable of communicatingwith the display apparatus 110 through the connector 210, e.g. theinterface circuit 222 can transmit and receive signals conforming to theRS232 standard.

The interface circuit 226 is coupled between the connector 230 and theprocessor 224. When the connector 230 is coupled to the semiconductormanufacturing machine 130, the interface circuit 226 is capable oftransferring signals conforming to the VGA standard. In the embodiment,the processor 224 can obtain a horizontal synchronization signal Hsync,a vertical synchronization signal Vsync and image data IMG correspondingto a graphical user interface (GUI) of the semiconductor manufacturingmachine 130 through the connector 230 and the interface circuit 226.Furthermore, the processor 224 obtains the display resolution Resol_2 ofthe semiconductor manufacturing machine 130. In some embodiments, thedisplay resolution Resol_2 is obtained from the semiconductormanufacturing machine 130 through the connector 230 and the interfacecircuit 226. In some embodiments, the display resolution Resol_2 isstored in the memory 228 in advance.

When obtaining the horizontal synchronization signal Hsync, the verticalsynchronization signal Vsync and the image data IMG, the processor 224can provide the horizontal synchronization signal Hsync, the verticalsynchronization signal Vsync and the image data IMG to the displayapparatus 110 through the connector 240. When receiving the horizontalsynchronization signal Hsync, the vertical synchronization signal Vsyncand the image data IMG, the display apparatus 110 is capable ofdisplaying the GUI of the semiconductor manufacturing machine 130 on thedisplay screen of the display apparatus 110 according to the displayresolution Resol_1. In some embodiments, the processor 224 is capable ofmodifying the horizontal synchronization signal Hsync, the verticalsynchronization signal Vsync and the image data IMG to match the displayresolution Resol_1 of the display apparatus 110.

When a user clicks the GUI displayed on the display screen of thedisplay apparatus 110, the interface circuit 222 can obtain a clickposition P_click from the display apparatus 110, and provides the clickposition P_click to the processor 224. In some embodiments, the clickposition P_click includes a first horizontal coordinate X1 and a firstvertical coordinate Y1 of the display screen of the display apparatus110. Furthermore, the processor 224 obtains the display resolutionResol_1 of the display apparatus 110. In some embodiments, the displayresolution Resol_1 is obtained from the display apparatus 110. In someembodiments, the display resolution Resol_1 is stored in the memory 228in advance.

When obtaining the display resolution Resol_1 of the display apparatus110 and the display resolution Resol_2 of the semiconductormanufacturing machine 130, the processor 224 can obtain a mapping tablebetween the display resolution Resol_1 of the display apparatus 110 andthe display resolution Resol_2 of the semiconductor manufacturingmachine 130. In general, the display resolution of a flat panel displayis greater than that of a CRT monitor.

Referring to FIG. 3, FIG. 3 shows a schematic illustrating a mappingrelationship between a first display resolution 1280×960 of a displayapparatus 310 (e.g. 110 of FIG. 1) and a second display resolution640×480 of a semiconductor manufacturing machine 330 (e.g. 130 of FIG.1). In FIG. 3, the display screen of the display apparatus 310 is formedby a plurality of pixels, and the pixels are arranged in an array formedby 960 rows R0-R959 and 1280 columns C0-C1279. Furthermore, the displayscreen of a CRT monitor corresponding to the semiconductor manufacturingmachine 330 is formed by a plurality of pixels, and the pixels arearranged in an array formed by 480 rows R0-R479 and 640 columns C0-C639.In the embodiment, the display screen of the display apparatus 310 istwice the length and width of the display screen corresponding to thesemiconductor manufacturing machine 330. Therefore, a click positionP_click located at pixel (R0,C0), (R0,C1), (R1,C0) or (R1,C1) of thedisplay screen of the display apparatus 310 will be converted into alight pen position located at pixel (R0,C0) of the display screencorresponding to the semiconductor manufacturing machine 330.

Referring back to FIG. 1 and FIG. 2 together, in some embodiments, amapping relationship between the display resolution Resol_1 of thedisplay apparatus 110 and the display resolution Resol_2 of thesemiconductor manufacturing machine 130 is calculated by the processor224 after obtaining the display resolutions Resol_1 and Resol_2, so asto obtain a mapping table of the display resolutions Resol_1 andResol_2. If the display resolution Resol_1 or Resol_2 is changed, theprocessor 224 will update the mapping relationship, so as to obtain anew mapping table.

In some embodiments, various mapping tables are stored in the memory 228in advance. After obtaining the display resolutions Resol_1 and Resol_2,the processor 224 can read a mapping table of the display resolutionsResol_1 and Resol_2 from the memory 228. If the display resolutionResol_1 or Resol_2 is changed, the processor 224 will read the memory228 to obtain a new mapping table of the changed display resolutionsResol_1 and Resol_2.

After obtaining the click position P_click from the display apparatus110, the processor 224 can convert the click position P_click into alight pen position P_light according to the mapping table correspondingto a mapping relationship between the display resolution Resol_1 of thedisplay apparatus 110 and the display resolution Resol_2 of thesemiconductor manufacturing machine 130. The light pen position P_lightis used to simulate a position where a change of brightness of thescreen of a CRT monitor is detected by a sensor of a light pen when theCRT monitor is scanned by an electron beam according to the horizontalsynchronization signal Hsync and the vertical synchronization signalVsync. In some embodiments, the light pen position P_light includes asecond horizontal coordinate X2 and a second vertical coordinate Y2 ofthe display screen of the CRT monitor.

For example, assigning the display resolution Resol_1 to be equal to1980×1950 and the display resolution Resol_2 to be equal to 640×480, theprocessor 224 can obtain a mapping table of the display resolutionsResol_1 and Resol_2. If the click position P_click is located at a setof coordinates (250, 550), i.e. X1=250 and Y1=550, the processor 224 canconvert the coordinates (250, 550) of the click position P_click intothe coordinates (80, 135) of the light pen position P_light according tothe mapping table), i.e. X2=80 and Y2=135.

After obtaining the light pen position P_light, the processor 224calculates or counts a specific time period TP corresponding to thelight pen position P_light according to the vertical synchronizationsignal Vsync, the horizontal synchronization signal Hsync, and a scanclock scan_clock. In some embodiments, the scan clock scan_clock isprovided by the semiconductor manufacturing machine 130. In someembodiments, the scan clock scan_clock is internally generated by thecontroller 220 according to the vertical synchronization signal Vsyncand the horizontal synchronization signal Hsync.

After the specific time period TP corresponding to the light penposition is reached, the processor 224 provides a light pen simulatedsignal S_light with a specific pulse width (about 200 μs) to thesemiconductor manufacturing machine 130.

After obtaining the light pen simulated signal S_light from theconverter 120, the semiconductor manufacturing machine 130 can performan operation corresponding to the specific option of the GUI. Asdescribed above, the GUI is displayed on the display screen of thedisplay apparatus 110, and after the specific option of the GUI isclicked, the display apparatus 110 will provide the click positionP_click to the converter 120.

If the semiconductor manufacturing machine 130 obtains the light pensimulated signal S_light and then performs another operation other thanthe operation corresponding to the specific option of the GUI, acalibration procedure can be performed through a user input interface(not shown) of the converter 120 or a calibration signal from thedisplay apparatus 110. In the calibration procedure, the mapping tableof the display resolutions Resol_1 and Resol_2 is modified by adding anoffset value.

Taking FIG. 3 as an example, by compensating for a horizontal offset(e.g. one row), a click position P_click located at pixel (R1,C0),(R1,C1), (R2,C0) or (R2,C1) of the display screen of the displayapparatus 310 will be converted into a light pen position located atpixel (R0,C0) of the display screen corresponding to the semiconductormanufacturing machine 330. Conversely, by compensating for a verticaloffset (e.g. one column), a click position P_click located at pixel(R0,C1), (R0,C2), (R1,C1) or (R1,C2) of the display screen of thedisplay apparatus 310 will be converted into a light pen positionlocated at pixel (R0,C0) of the display screen corresponding to thesemiconductor manufacturing machine 330.

FIG. 4 shows a waveform illustrating a horizontal synchronization signalHsync and a vertical synchronization signal Vsync provided by asemiconductor manufacturing machine (e.g. 130 of FIG. 1), in accordancewith some embodiments of the disclosure. Both the horizontalsynchronization signal Hsync and the vertical synchronization signalVsync provided by the semiconductor manufacturing machine are needed tocreate a fully stable picture in a display monitor of a display. Itshould be noted that the waveforms of the signals in FIG. 4 are used asan example, and not to limit the disclosure.

The vertical synchronization signal Vsync is a pulse transmitted at thebeginning of each frame period P1. In response to each pulse of thevertical synchronization signal Vsync, a monitor will start displaying anew image or frame, and the monitor starts in the upper left corner ofthe display screen.

The horizontal synchronization signal Hsync is a pulse at the beginningof each video line (e.g. each row) which keeps the horizontal scanningof the monitor exactly in step with the transmission of each new line.In response to each pulse of the horizontal synchronization signalHsync, the monitor will refresh the pixels or dots of the same rowcorresponding to the pulse in each scan period P2.

In FIG. 4, when the vertical synchronization signal Vsync changes from ahigh logic level to a low logic level, the display screen of the monitorwill start refreshing to display a frame of an image or a picture.During each frame period P1, 480 pulses of the horizontalsynchronization signal Hsync are used to scan the rows R0-R479 of thedisplay screen. Furthermore, during each scan period P2, 640 pulses ofthe scan clock scan_clock are used to scan the pixels of columns C0-C639in the same row, respectively.

As described above, according to the horizontal synchronization signalHsync, the vertical synchronization signal Vsync and the scan clockscan_clock, a specific time period TP corresponding to the light penposition P_light is counted by a processor (e.g. 224 of FIG. 2) of theconverter. For example, assuming that the light pen position P_light isat coordinates (80, 135), and the processor starts to count the specifictime period TP after the vertical synchronization signal Vsync changesfrom a low logic level to a high logic level. After counting that 135pulses of the horizontal synchronization signal Hsync and 80 pulses ofthe scan clock scan_clock have been passed, the processor determinesthat the specific time period TP is reached, and then the processorprovides the light pen simulated signal S_light with a pulse width of200 μs to the semiconductor manufacturing machine.

FIG. 5 shows a conversion method for converting a click position of adisplay into a light pen simulated signal for a semiconductormanufacturing machine (e.g. 130 of FIG. 1), in accordance with someembodiments of the disclosure.

In operation S510, a converter (e.g. 120 of FIG. 1) obtains a horizontalsynchronization signal Hsync, a vertical synchronization signal Vsync,and image data IMG corresponding to a GUI of the semiconductormanufacturing machine through a first D-sub connector (e.g. 230 of FIG.2) of the converter.

In operation S520, the converter provides the horizontal synchronizationsignal Hsync, the vertical synchronization signal Vsync, and the imagedata IMG to a display apparatus (e.g. 110 of FIG. 1) through a secondD-sub connector (e.g. 240 of FIG. 2) of the converter, so as to displaythe GUI on a display screen of the display apparatus.

In operation S530, when a specific option of the GUI displayed on thedisplay screen of the display apparatus is clicked, the converterobtains a click position P_click from the display apparatus.

In operation S540, the converter converts the click position P_clickinto a light pen position P_light according to a display resolutionResol_1 of the display apparatus and a display resolution Resol_2 of thesemiconductor manufacturing machine. As described above, a mapping tableof the display resolutions Resol_1 and Resol_2 is used to obtain thelight pen position P_light. When the display resolution Resol_1 orResol_2 is changed, the converter will update the mapping table. Thelight pen position P_light is used to simulate a position where a changeof brightness of the screen of a CRT monitor is detected by a sensor ofa light pen when the CRT monitor is scanned by an electron beamaccording to the horizontal synchronization signal Hsync and thevertical synchronization signal Vsync.

In operation S550, in response to the vertical synchronization signalVsync and the horizontal synchronization signal Hsync, the convertercounts a specific time period TP according to the light pen positionP_light. When the specific time period TP is reached, the converterprovides a light pen simulated signal S_light with a specific pulsewidth to the semiconductor manufacturing machine.

After obtaining the light pen simulated signal S_light from theconverter, the semiconductor manufacturing machine can perform anoperation corresponding to the specific option of the GUI, so as tomanufacture semiconductor devices.

Embodiments for converters and conversion methods for converting a clickposition of a display into a light pen simulated signal for asemiconductor manufacturing machine are provided. When a specific optionof the GUI displayed on a display screen of a flat panel display isclicked, a click position P_click is obtained through an RS232connector. According to a mapping table of a display resolution Resol_1of the flat panel display and a display resolution Resol_2 of thesemiconductor manufacturing machine, the click position P_click isconverted into a light pen position P_light. The light pen positionP_light represents a simulated position where a change of brightness ofthe screen of a CRT monitor is detected by a sensor of a light pen whenthe CRT monitor is scanned by an electron beam according to a horizontalsynchronization signal Hsync and a vertical synchronization signal Vsyncfrom the semiconductor manufacturing machine. A light pen simulatedsignal S_light with a specific pulse width is provided to thesemiconductor manufacturing machine when a specific time period TPcorresponding to the light pen position P_light is reached. Thus, thesemiconductor manufacturing machine can perform an operationcorresponding to the specific option of the GUI, so as to manufacturesemiconductor devices.

In some embodiments, a converter for converting a click position of aflat panel display into a light pen simulated signal for a semiconductormanufacturing machine is provided. The converter includes a firstconnector, a second connector, and a controller coupled between thefirst connector and the second connector. The first connector isconfigured to obtain the click position from the flat panel display. Thesecond connector is configured to provide the light pen simulated signalto the semiconductor manufacturing machine according to asynchronization signal from the semiconductor manufacturing machine. Thecontroller is configured to generate the light pen simulated signalaccording to the click position and a mapping table of a first displayresolution of the flat panel display and a second display resolution ofthe semiconductor manufacturing machine. The first display resolution ishigher than the second display resolution.

In some embodiments, a conversion method for converting a click positionof a flat panel display into a light pen simulated signal for asemiconductor manufacturing machine is provided. The click position isobtained when an option of a graphical user interface (GUI) of thesemiconductor manufacturing machine displayed on a display screen of theflat panel display is selected. The light pen simulated signal isobtained according to the click position, a first display resolution ofthe flat panel display and a second display resolution of thesemiconductor manufacturing machine. The light pen simulated signal isprovided to the semiconductor manufacturing machine according to asynchronization signal from the semiconductor manufacturing machine.

In some embodiments, a semiconductor manufacturing system is provided.The semiconductor manufacturing system includes a semiconductormanufacturing machine, a flat panel display and a converter coupled tothe semiconductor manufacturing machine through a first cable and theflat panel display through a second cable. The flat panel display isconfigured to display a graphical user interface (GUI) of thesemiconductor manufacturing machine. The converter is configured toconvert a click position from the flat panel display into a light penposition according to a mapping table of a first display resolution ofthe flat panel display and a second display resolution of thesemiconductor manufacturing machine, and to provide a light pensimulated signal to the semiconductor manufacturing machine according tothe light pen position and a synchronization signal from thesemiconductor manufacturing machine. The first display resolution ishigher than the second display resolution.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A converter for converting a click position of aflat panel display into a light pen simulated signal for a semiconductormanufacturing machine, comprising: a first connector configured toobtain the click position from the flat panel display; a secondconnector configured to provide the light pen simulated signal to thesemiconductor manufacturing machine according to a synchronizationsignal from the semiconductor manufacturing machine; and a controllercoupled between the first connector and the second connector, andconfigured to generate the light pen simulated signal according to theclick position and a mapping table of a first display resolution of theflat panel display and a second display resolution of the semiconductormanufacturing machine, wherein the first display resolution is higherthan the second display resolution.
 2. The converter as claimed in claim1, wherein the click position represents a position that corresponds toa first horizontal coordinate and a first vertical coordinate on adisplay screen of the flat panel display that has been clicked, and thecontroller converts the first horizontal coordinate and the firstvertical coordinate into a light pen position according to the mappingtable.
 3. The converter as claimed in claim 2, wherein the light penposition represents a simulated position corresponding to a secondhorizontal coordinate and a second vertical coordinate on a displayscreen of a cathode ray tube (CRT) display.
 4. The converter as claimedin claim 1, wherein the controller comprises a memory configured tostore the mapping table.
 5. The converter as claimed in claim 1, whereinin response to the synchronization signal, the controller counts aspecific time period corresponding to the click position, and providesthe light pen simulated signal to the semiconductor manufacturingmachine through the second connector when the specific time period isreached.
 6. The converter as claimed in claim 5, wherein a pulse widthof the light pen simulated signal provided to the semiconductormanufacturing machine is 200 μs.
 7. The converter as claimed in claim 1,wherein the first connector is an RS232 connector, and the secondconnector is a D-subminiature connector.
 8. The converter as claimed inclaim 1, wherein the click position indicates that a specific option ofa graphical user interface of the semiconductor manufacturing machinedisplayed on a display screen of the flat panel display is selected, andin response to the light pen simulated signal, the semiconductormanufacturing machine performs a specific operation corresponding to thespecific option to manufacture a semiconductor device.
 9. A conversionmethod for converting a click position of a flat panel display into alight pen simulated signal for a semiconductor manufacturing machine,comprising: obtaining the click position when an option of a graphicaluser interface (GUI) of the semiconductor manufacturing machinedisplayed on a display screen of the flat panel display is selected;obtaining the light pen simulated signal according to the clickposition, a first display resolution of the flat panel display and asecond display resolution of the semiconductor manufacturing machine;and providing the light pen simulated signal to the semiconductormanufacturing machine according to a synchronization signal from thesemiconductor manufacturing machine.
 10. The conversion method asclaimed in claim 9, wherein the click position represents a positionthat corresponds to a first horizontal coordinate and a first verticalcoordinate on the display screen of the flat panel display that has beenclicked, wherein obtaining the light pen simulated signal according tothe click position, the first display resolution of the flat paneldisplay and the second display resolution of the semiconductormanufacturing machine further comprises: converting the first horizontalcoordinate and the first vertical coordinate into a light pen positionaccording to a mapping table of the first and second displayresolutions.
 11. The conversion method as claimed in claim 10, whereinthe light pen position represents a simulated position corresponding toa second horizontal coordinate and a second vertical coordinate on adisplay screen of a cathode ray tube (CRT) display.
 12. The conversionmethod as claimed in claim 10, wherein providing the light pen simulatedsignal to the semiconductor manufacturing machine according to thesynchronization signal from the semiconductor manufacturing machinefurther comprises: counting a specific time period corresponding to thelight pen position in response to the synchronization signal; andproviding the light pen simulated signal to the semiconductormanufacturing machine when the specific time period is reached.
 13. Theconversion method as claimed in claim 12, wherein a pulse width of thelight pen simulated signal provided to the semiconductor manufacturingmachine is 200 μs.
 14. The conversion method as claimed in claim 9,further comprising: obtaining the first display resolution and thesecond display resolution from a memory, wherein the first displayresolution is higher than the second display resolution;
 15. Theconversion method as claimed in claim 9, wherein the click position isobtained through an RS232 connector, and the synchronization signal isobtained through a D-subminiature connector.
 16. The conversion methodas claimed in claim 9, wherein in response to the light pen simulatedsignal, the semiconductor manufacturing machine performs a specificoperation corresponding to the option to manufacture a semiconductordevice.
 17. A semiconductor manufacturing system, comprising: asemiconductor manufacturing machine; a flat panel display configured todisplay a graphical user interface (GUI) of the semiconductormanufacturing machine; and a converter coupled to the semiconductormanufacturing machine through a first cable and the flat panel displaythrough a second cable, and configured to convert a click position fromthe flat panel display into a light pen position according to a mappingtable of a first display resolution of the flat panel display and asecond display resolution of the semiconductor manufacturing machine,and to provide a light pen simulated signal to the semiconductormanufacturing machine according to the light pen position and asynchronization signal from the semiconductor manufacturing machine,wherein the first display resolution is higher than the second displayresolution.
 18. The semiconductor manufacturing system as claimed inclaim 17, wherein the click position represents a position thatcorresponds to a first horizontal coordinate and a first verticalcoordinate on a display screen of the flat panel display that has beenclicked, and the converter converts the first horizontal coordinate andthe first vertical coordinate into the light pen position according tothe mapping table, wherein the light pen position represents a simulatedposition corresponding to a second horizontal coordinate and a secondvertical coordinate on a display screen of a cathode ray tube (CRT)display.
 19. The semiconductor manufacturing system as claimed in claim17, wherein in response to the synchronization signal, the convertercounts a specific time period corresponding to the light pen position,and provides the light pen simulated signal to the semiconductormanufacturing machine when the specific time period is reached.
 20. Thesemiconductor manufacturing system as claimed in claim 19, wherein thefirst cable supports video graphics array (VGA) standard, and the secondcable supports the RS232 serial port standard.